2292BG Details_2292BG Related parameters PDF_Aavid, Thermal Division of Boyd Corporation-Winwic

Thermal - Heat Sinks

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In Stock：20,718(Ref. price)

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Specifications

Description	Details
Series	-
Package	Bulk
Type	Board Level
Package Cooled	BGA
Attachment Method	Thermal Tape, Adhesive (Not Included)
Shape	Cylindrical
Length	-
Width	-
Diameter	0.300" (7.62mm) ID, 1.125" (28.57mm) OD
Fin Height	-
Power Dissipation @ Temperature Rise	1.5W @ 40°C
Thermal Resistance @ Forced Air Flow	8.00°C/W @ 400 LFM
Thermal Resistance @ Natural	-
Material	Aluminum
Material Finish	Black Anodized

Other

Price advantage, 2292BG is available in stock and can be delivered on the same day

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