ICF-318-T-I-TR Details_ICF-318-T-I-TR Related parameters PDF

Sockets for ICs Transistors

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Specifications

Description	Details
Series	iCF
Package	Tape & Reel (TR)
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	18 (2 x 9)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Tin
Contact Finish Thickness - Mating	-
Contact Material - Mating	Beryllium Copper
Mounting Type	Surface Mount
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	-
Contact Material - Post	Beryllium Copper
Housing Material	Liquid Crystal Polymer (LCP)
Operating Temperature	-55°C ~ 125°C

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