01-0513-11H Details_01-0513-11H Related parameters PDF

Sockets for ICs Transistors

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Specifications

Description	Details
Series	0513
Package	Bulk
Type	SIP
Number of Positions or Pins (Grid)	1 (1 x 1)
Pitch - Mating	-
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	-
Termination	Solder
Pitch - Post	-
Contact Finish - Post	Gold
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Material - Post	Brass
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature	-

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