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Sockets for ICs Transistors
SIP1X08-014BLF Picture

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SIP1X08-014BLF

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In Stock:17,296(Ref. price)
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Documents
Specifications
DescriptionDetails
Series
SIP1x
Package
Bulk
Type
SIP
Number of Positions or Pins (Grid)
8 (1 x 8)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin
Contact Finish Thickness - Mating
150.0µin (3.81µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Brass
Housing Material
Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature
-
Other
Price advantage, SIP1X08-014BLF is available in stock and can be delivered on the same day
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