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Sockets for ICs Transistors
4-2013620-3 Picture

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4-2013620-3

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In Stock:17,602(Ref. price)
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Documents
Specifications
DescriptionDetails
Series
-
Package
Tape & Reel (TR)
Type
PGA, ZIF (ZIP)
Number of Positions or Pins (Grid)
989 (35 x 36)
Pitch - Mating
0.039" (1.00mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
15.0µin (0.38µm)
Contact Material - Mating
Copper Alloy
Mounting Type
Surface Mount
Features
Open Frame
Termination
Solder
Pitch - Post
0.039" (1.00mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
15.0µin (0.38µm)
Contact Material - Post
Copper Alloy
Housing Material
Thermoplastic
Operating Temperature
-
Other
Price advantage, 4-2013620-3 is available in stock and can be delivered on the same day
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