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Sockets for ICs Transistors
818-AG11SM Picture

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818-AG11SM

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In Stock:20,178(Ref. price)
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Documents
Specifications
DescriptionDetails
Series
800
Package
Bulk
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
18 (2 x 9)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
-
Contact Material - Mating
Copper Alloy
Mounting Type
Surface Mount
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
-
Contact Material - Post
Copper Alloy
Housing Material
Thermoplastic, Polyester
Operating Temperature
-
Other
Price advantage, 818-AG11SM is available in stock and can be delivered on the same day
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