H80700800000G Details_H80700800000G Related parameters PDF

Wire to Board

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Specifications

Description	Details
Series	H8
Package	Bulk
Number of Levels	1
Positions Per Level	7
Pitch	0.394" (10.00mm)
Mating Orientation	45° (135°) Angle with Board
Current	37 A
Voltage	300 V
Wire Gauge	6-24 AWG
Mounting Type	Through Hole
Wire Termination	Screwless - Leg Spring, Push-In Spring
Features	-
Color	Gray

Other

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Winwic Technology Co., Limited

Tel: 852-52999291

Phone: 852-52999291

Address: Unit 6F A, KK Industrial building MOK CHEONG STREET ,To Kwa Wan,KL HongKong

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