HL0200900000G Details_HL0200900000G Related parameters PDF

Wire to Board

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Specifications

Description	Details
Series	HL
Package	Bulk
Number of Levels	1
Positions Per Level	2
Pitch	0.138" (3.50mm)
Mating Orientation	Horizontal and Vertical with Board
Current	2 A
Voltage	300 V
Wire Gauge	16-20 AWG
Mounting Type	Through Hole, Kinked Pin
Wire Termination	Screwless - IDC and Leg Spring, Push-In Spring
Features	-
Color	White

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Winwic Technology Co., Limited

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