HG2200800000G Details_HG2200800000G Related parameters PDF

Wire to Board

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Specifications

Description	Details
Series	HG
Package	Bulk
Number of Levels	1
Positions Per Level	22
Pitch	0.197" (5.00mm)
Mating Orientation	45° (135°) Angle with Board
Current	15 A
Voltage	300 V
Wire Gauge	12-28 AWG
Mounting Type	Through Hole
Wire Termination	Screwless - Leg Spring, Push-In Spring
Features	Interlocking (Side)
Color	Gray

Other

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Winwic Technology Co., Limited

Tel: 852-52999291

Phone: 852-52999291

Address: Unit 6F A, KK Industrial building MOK CHEONG STREET ,To Kwa Wan,KL HongKong Zipcode: 999077

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