LTN20069 Details_LTN20069 Related parameters PDF

Thermal - Heat Sinks

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Specifications

Description	Details
Series	Penguin
Package	Bulk
Type	Board Level
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method	Thermal Tape, Adhesive (Included)
Shape	Square, Fins
Length	0.650" (16.51mm)
Width	0.653" (16.59mm)
Diameter	-
Fin Height	0.350" (8.89mm)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	8.00°C/W @ 500 LFM
Thermal Resistance @ Natural	-
Material	Aluminum
Material Finish	Black Anodized

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