BGAH170-075E Details_BGAH170-075E Related parameters PDF

Thermal - Heat Sinks

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Specifications

Description	Details
Series	BG
Package	Box
Type	Top Mount
Package Cooled	BGA, CPU, GPU
Attachment Method	Thermal Tape, Adhesive (Included)
Shape	Square, Angled Fins
Length	0.669" (17.00mm)
Width	0.669" (17.00mm)
Diameter	-
Fin Height	0.295" (7.50mm)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	-
Thermal Resistance @ Natural	17.10°C/W
Material	Aluminum Alloy
Material Finish	Black Anodized

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Winwic Technology Co., Limited

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Phone: 852-52999291

Address: Unit 6F A, KK Industrial building MOK CHEONG STREET ,To Kwa Wan,KL HongKong Zipcode: 999077

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