EYG-S1116ZLSC Details_EYG-S1116ZLSC Related parameters PDF_Panasonic Electronic Components-Winwic

Thermal - Pads

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In Stock：700(Ref. price)

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Specifications

Description	Details
Series	Soft-PGS
Package	Bulk
Usage	IGBT - Heat Transfer Low Thermal Resistance
Type	Graphite-Pad, Sheet
Shape	Rectangular
Outline	158.00mm x 112.00mm
Thickness	0.0079" (0.200mm)
Material	Graphite
Adhesive	-
Backing, Carrier	-
Color	Gray
Thermal Resistivity	-
Thermal Conductivity	20W/m-K

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