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Adapter、 Breakout Boards
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DE02008

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Specifications
DescriptionDetails
Series
-
Package
Bag
Proto Board Type
SMD to DIP
Package Accepted
SOIC, SOP, SSOP
Number of Positions
8
Pitch
0.100"" (2.54mm)
Board Thickness
0.063"" (1.60mm)
Material
FR4 Epoxy Glass
Size / Dimension
0.433"" L x 0.472"" W (11.00mm x 12.00mm)
Other
Price advantage, DE02008 is available in stock and can be delivered on the same day
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