733024 Details_733024 Related parameters PDF

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Specifications

Description	Details
Series	C400
Package	Bulk
Type	Wire Solder
Composition	Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Diameter	0.022" (0.56mm)
Melting Point	423°F (217°C)
Flux Type	No-Clean
Wire Gauge	23 AWG, 24 SWG
Process	Lead Free
Form	Spool, 8.8 oz (250g)
Shelf Life	-
Shelf Life Start	-
Storage/Refrigeration Temperature	59°F ~ 86°F (15°C ~ 30°C)

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