TS991SNL500T3 Details_TS991SNL500T3 Related parameters PDF

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Specifications

Description	Details
Series	CHIPQUIK®
Package	Bulk
Type	Solder Paste
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter	-
Melting Point	423°F (217°C)
Flux Type	No-Clean
Wire Gauge	-
Process	Leaded
Form	Jar, 17.64 oz (500g)
Shelf Life	12 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	-

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