733010 Details_733010 Related parameters PDF

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Specifications

Description	Details
Series	C511™
Package	Bulk
Type	Wire Solder
Composition	Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Diameter	0.032" (0.81mm)
Melting Point	423°F (217°C)
Flux Type	No-Clean
Wire Gauge	20 AWG, 21 SWG
Process	Lead Free
Form	Spool, 1 lb (454 g)
Shelf Life	-
Shelf Life Start	-
Storage/Refrigeration Temperature	-

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