4860P-250G Details_4860P-250G Related parameters PDF

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Specifications

Description	Details
Series	4860
Package	Bulk
Type	Solder Paste
Composition	Sn63Pb37 (63/37)
Diameter	-
Melting Point	361°F (183°C)
Flux Type	No-Clean
Wire Gauge	-
Process	Leaded
Form	Jar, 8.8 oz (250g)
Shelf Life	24 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	35°F ~ 50°F (2°C ~ 10°C)

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