437756 Details_437756 Related parameters PDF

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Specifications

Description	Details
Series	366
Package	Bulk
Type	Wire Solder
Composition	Sn50Pb48.5Cu1.5 (50/48.5/1.5)
Diameter	0.032" (0.81mm)
Melting Point	361 ~ 420°F (183 ~ 216°C)
Flux Type	Rosin Activated (RA)
Wire Gauge	20 AWG, 21 SWG
Process	Leaded
Form	Spool, 17.64 oz (500g)
Shelf Life	-
Shelf Life Start	-
Storage/Refrigeration Temperature	-

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Winwic Technology Co., Limited

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