1728117 Details_1728117 Related parameters PDF

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Specifications

Description	Details
Series	LF318
Package	Bulk
Type	Solder Paste
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter	-
Melting Point	423°F (217°C)
Flux Type	No-Clean
Wire Gauge	-
Process	Lead Free
Form	Syringe, 0.88 oz (25g)
Shelf Life	6 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	32°F ~ 50°F (0°C ~ 10°C)

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