57-3343-8109 Details_57-3343-8109 Related parameters PDF

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Specifications

Description	Details
Series	-
Package	Jar
Type	Solder Paste
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter	-
Melting Point	423 ~ 424°F (217 ~ 218°C)
Flux Type	-
Wire Gauge	-
Process	Lead Free
Form	Jar, 17.64 oz (500g)
Shelf Life	-
Shelf Life Start	-
Storage/Refrigeration Temperature	-

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